The Diaspora Innovation & AI Conference (DIAC) 2026, organized by the Kenya–USA

Tech Forum (KUSAT), is a two-day international conference scheduled for June 2026 in

Washington, D.C., bringing together approximately 200 participants from across the global

diaspora.

DIAC 2026 convenes diaspora scholars, students, policymakers, industry leaders, and

innovators from Kenya and the United States to advance dialogue and collaboration in

STEM, AI, innovation, entrepreneurship and global development.

The conference offers sponsors and partners strategic visibility, thought leadership

positioning, and direct engagement with policymakers and high-potential talent, while

supporting transformative solutions shaping the future of technology and development.

Attendees and participants benefit from expert-led discussions, networking opportunities,

exposure to cutting-edge innovations, and platforms to present research and showcase

impactful initiatives.

Please find below the available sponsorship packages and associated benefits.

Conference Tickets (USD)

• Listener: $200

• Presenter: $300

Sponsorship Packages (USD)

• Double Platinum Sponsor: $15,000

• Platinum Sponsor: $10,000

• Diamond Sponsor: $7,500

• Gold Sponsor: $5,000

• Silver Sponsor: $2,500

• Bronze Sponsor: $1,500

• VIP Attendee Package: $1,000

We look forward to your valued engagement in making DIAC 2026 a resounding success.